MTBob
Well-Known Member
I'm new to this forum, and I've tried to find the answer to these questions in previous postings related to bonding epoxy, specifically G/Flex 655.
Two Questions:
1: I know that epoxy needs a roughened surface to bond adequately. I've used a dremel tool to roughen the surface on a few knives, but it's a rather random effect and, without care, can mark the edge of the tang or G10 that might be visible on the final finish. Recently I tried lightly blasting the tang and G10 with 70 grit aluminum oxide media. That process results in a uniform abrasion to the surfaces of the metal and scale and eliminating any shiny / slick surfaces.
So, do you think that media blasting the surfaces is better, or worse, than using a hand grinder to roughen the surfaces? Or, is there some other process that I should use?
2. Also, I understand that too much clamping pressure can result in a weakened glue bond. I see some of you use spring hand clamps, while others use c-clamps, or some variation of those clamps. How do you know how much pressure to apply to the scales? I've been using c-clamps with a lot of pressure, thinking that a lot of pressure will assure that the glue is pushed in the microscopic holes and bond better. But... I've also read that too much pressure will reduce the epoxy thickness to a point where it can result in delamination.
Any thoughts would be appreciated.
MTBob
Two Questions:
1: I know that epoxy needs a roughened surface to bond adequately. I've used a dremel tool to roughen the surface on a few knives, but it's a rather random effect and, without care, can mark the edge of the tang or G10 that might be visible on the final finish. Recently I tried lightly blasting the tang and G10 with 70 grit aluminum oxide media. That process results in a uniform abrasion to the surfaces of the metal and scale and eliminating any shiny / slick surfaces.
So, do you think that media blasting the surfaces is better, or worse, than using a hand grinder to roughen the surfaces? Or, is there some other process that I should use?
2. Also, I understand that too much clamping pressure can result in a weakened glue bond. I see some of you use spring hand clamps, while others use c-clamps, or some variation of those clamps. How do you know how much pressure to apply to the scales? I've been using c-clamps with a lot of pressure, thinking that a lot of pressure will assure that the glue is pushed in the microscopic holes and bond better. But... I've also read that too much pressure will reduce the epoxy thickness to a point where it can result in delamination.
Any thoughts would be appreciated.
MTBob